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Die Bonders Used For Ic And Led Package

Posted at: Offers to Sell and Export | Posted on: Mon 05 May, 2008 1:12 am |
die bonders ic led package
Products Photos CatalogDie Bonders Led Photos Catalog

Chip Size: 0.2mm*0.2mm-2mm*2mm

Application: Leadframes, PCB

Dimension of Leadframe:

L: 6.0″-11.4″(150-290mm)

W: 0.6″-3.15″(15-80mm)

H: 4-30mil (0.1-0.75mm)

UPH: 9000(□1mm*□1mm)

Wafer: Max 8 inches(200mm)

Wafer Table:237.5237.5mm


Unpack: 181010351446mm

Packed: 191012801710mm

Bonding Power: 30-2000g

Bonding Accuracy: 50μm,3o

Compressed Air: 0.5MPa

Voltage: 220VAC

Power: 1800 W

Company Contact:

Wxx0418 photo
Contact Name: Sheila Wu
Company Name: Dalian Jafeng Electronics Co., Ltd.
Email: Email
Tel: 86-411-84755101
Fax: 86-411-84791210
Street Address: No., 97, Guangxian
Road, High-tech Zone, Dalian,
Liaoning, China
Website: http://www.visionjafeng.com
Member name: Wxx0418
Country: China-CN China
Member Since: 04 May 2008
Total Leads: 1 Wxx0418 Import Export Business Leads
Business focus: Die Bonder. Die Attach. Semiconductor Packaging Equipment, Ic, Led, Transistor Packaging Equipment
Verify: Safe Import Export Tips

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