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Die Bonders Used For Ic And Led Package

Posted at: TradersCity --> Offers to Sell and Export

Posted on: Mon 05 May, 2008 1:12 am

die bonders ic led package
Chip Size: 0.2mm*0.2mm-2mm*2mm
Application: Leadframes, PCB
Dimension of Leadframe:
L: 6.0″-11.4″(150-290mm)
W: 0.6″-3.15″(15-80mm)
H: 4-30mil (0.1-0.75mm)
UPH: 9000(□1mm*□1mm)
Wafer: Max 8 inches(200mm)
Wafer Table:237.5×237.5mm
Demision:
Unpack: 1810×1035×1446mm
Packed: 1910×1280×1710mm
Bonding Power: 30-2000g
Bonding Accuracy: ±50μm,±3o
Compressed Air: 0.5MPa
Voltage: 220VAC
Power: 1800 W


_________________
Contact Name: Sheila Wu
Company Name: Dalian Jafeng Electronics Co., Ltd.
Email: Wxx0418@163.com
Tel: 86-411-84755101
Fax: 86-411-84791210
Street Address: No., 97, Guangxian
Road, High-tech Zone, Dalian,
Liaoning, China

Posted By Wxx0418
Country: China-CN China
Member Since: 04 May 2008
Total Leads: 1
Business focus: Die Bonder. Die Attach. Semiconductor Packaging Equipment, Ic, Led, Transistor Packaging Equipment
View user's profile Send e-mail Visit poster's website

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