Chip Size: 0.2mm*0.2mm-2mm*2mm
Application: Leadframes, PCB
Dimension of Leadframe:
L: 6.0″-11.4″(150-290mm)
W: 0.6″-3.15″(15-80mm)
H: 4-30mil (0.1-0.75mm)
UPH: 9000(□1mm*□1mm)
Wafer: Max 8 inches(200mm)
Wafer Table:237.5×237.5mm
Demision:
Unpack: 1810×1035×1446mm
Packed: 1910×1280×1710mm
Bonding Power: 30-2000g
Bonding Accuracy: ±50μm,±3o
Compressed Air: 0.5MPa
Voltage: 220VAC
Power: 1800 W
_________________
Contact Name: Sheila Wu
Company Name: Dalian Jafeng Electronics Co., Ltd.
Email: Wxx0418@163.com
Tel: 86-411-84755101
Fax: 86-411-84791210
Street Address: No., 97, Guangxian
Road, High-tech Zone, Dalian,
Liaoning, China