Hi-Tg Thick Copper Board with Blind and Buried Holes
Material:FR-4 TG=170
Copper Wt for I/O layer:4OZ
Layer Count:16-layer
Board Thickness:3.0mm
Blind & Buried Holes:2-3,1-8,9-16
Finish:Immersion Au
_________________
Contact Name: Grace Tong
Company Name: Core International Industry Co., Ltd.
Email: sale01@corepcb.com
Tel: +86 755-86176959
Fax: +86 755-86176959-810
Street Address: Room 804, Building A,
Nantou Dongfangxindi Garden, Shennan
Road, Nanshan District, Shenzhen,
Guangdong, China