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Metal Base Copper Clad Laminate

Posted at: Offers to Sell and Export | Posted on: Mon 14 Dec, 2009 5:56 am | | Germany | USA
 
metal base copper clad laminate
Products Photos CatalogMetal Base Copper Clad Photos Catalog



Item Testcondition Index

YH-01 copper clad laminate YH-02 YH-03


Thermal Conductivity (W/m.k) A

1.0~1.5 1.5~2.0 2.0~3.0

Peel Strength (N/mm) A After thermal stress ≥1.8 ≥1.8 ≥1.8

Blister test After Thermal stress A After thermal impact 260℃2min 288℃ 2min 300℃ 2min

Flammability UL94 V-0 V-0 V-0

Thermal resistance max (℃/W) A ≤1.2 ≤1.0 ≤0.75

Surface Resistivity (MΩ.m) A

Constant humidity treatment (90%, 35 ℃, 96H) ≥1×105 ≥1×105 ≥1×106

Volume Resistively (MΩ.m) A (90%, 35 ℃, 96H) ≥1.8×106 ≥1.8×106 ≥1.8×107

Dielectric Breakdown (KV)/min A ≥2.0≥2.5 ≥3.0

Dielectric Constant(1MHz) (40 ℃, 90%, 96H) ≤4.4 ≤3 ≤2.5

Dissipation Factor (40 ℃, 90%, 96H) ≤0.03 ≤0.03 ≤0.03



Company Contact:

No member photo
Contact Name: Cindy
Company Name: Zhuhai Sanny Co., Ltd
Email: Email
Tel: 86 0756-3236181
Fax: 86 0756-3236182
Street Address: No.1164, Jiuzhou
Road East, Jida, Zhuhai City,
Guangdong Province, China
Website: http://www.zhhkpcb.com
Member name: zhhkpcb
Country: China-CN China
Member Since: 14 December 2009
Total Leads: 5 zhhkpcb Import Export Business Leads
Business focus: Pcb, Ccl, Aluminum Pcb, Aluminum Base Ccl, Printed Circuit Board, Copper Clad Laminate, Insulated Material Substrate
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